Ansys ExaltoAnsys
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Ansys RedHawk-SCAnsys
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About
Ansys Exalto is a post-LVS RLCk extraction software solution that enables IC designers to accurately capture unknown crosstalk among different blocks in the design hierarchy by extracting lumped-element parasitics and generating an accurate model for electrical, magnetic and substrate coupling. Exalto interfaces with most LVS tools and can complement the RC extraction tool of your choice. Ansys Exalto post-LVS RLCk extraction lets IC designers accurately predict electromagnetic and substrate coupling effects for signoff on circuits that were previously "too big to analyze.” The extracted models are back-annotated to the schematic or netlist, and support all circuit simulators. The proliferation of RF and high-speed circuits in modern silicon systems has raised electromagnetic coupling to a first order effect that must be accurately modeled to reliably achieve silicon success.
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About
Ansys RedHawk-SC is the industry’s trusted gold standard voltage drop and electromigration multiphysics sign-off solution for digital designs. Its powerful analytics quickly identify any weaknesses and allow what-if explorations to optimize power and performance. Redhawk-SC’s cloud-based architecture gives it the speed and capacity to handle full-chip analysis. Signoff accuracy is certified by all major foundries for all finFET nodes, down to 3nm. Ansys RedHawk-SC enables robust, low-power digital designs without performance loss thanks to advanced power analytics that give designers comprehensive techniques to detect and correct dynamic voltage drop. Ansys RedHawk-SC’s trusted multiphysics signoff analysis is a powerful way to reduce project and technology risk. RedHawk’s algorithms are certified accurate by all major foundries for all finFET processes and are proven in thousands of tapeouts.
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Platforms Supported
Windows
Mac
Linux
Cloud
On-Premises
iPhone
iPad
Android
Chromebook
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Platforms Supported
Windows
Mac
Linux
Cloud
On-Premises
iPhone
iPad
Android
Chromebook
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Audience
Post-LVS RLCk extraction software solution that enables IC design engineers to accurately predict electromagnetic coupling effects during the signoff phase
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Audience
Anyone looking for an electrical design solution for voltage drop, electromigration and electrothermal reliability signoff for SoC and 3DIC co-design
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Support
Phone Support
24/7 Live Support
Online
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Support
Phone Support
24/7 Live Support
Online
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API
Offers API
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API
Offers API
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Screenshots and Videos |
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Pricing
No information available.
Free Version
Free Trial
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Pricing
No information available.
Free Version
Free Trial
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Reviews/
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Reviews/
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Training
Documentation
Webinars
Live Online
In Person
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Training
Documentation
Webinars
Live Online
In Person
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Company InformationAnsys
Founded: 1970
United States
www.ansys.com/products/semiconductors/ansys-exalto
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Company InformationAnsys
Founded: 1970
United States
www.ansys.com/products/semiconductors/ansys-redhawk-sc
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Integrations
AWS Marketplace
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